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For leading-edge PCB designs, the embedded component technology feature provides the essential option for buried components. This technology includes support for buried/printed resistors, buried capacitors, RF spiral inductors and planar transformers.
Passive Components Passive resistors can be printed on inner layers and connected by resistive material. Depending on the manufacturing method, a resist mask or encapsulating coating will be required. The Pulsonix Embedded Components option handles this by allowing you to associate the necessary additional manufacturing layers for the resistive and other materials with the correct inner copper layer. Planar Components
The planar converter or transfer component may exist on the outer only or through-hole layers and may have a physical body applied to the outer layers. However, part of the footprint consists of copper spirals which are connected by a component via, effectively joining the two footprint pads. By defining the footprint as embedded, the Component can be mirrored and all the inner layers will swap as required. Special DRC properties also allow the right internal connectivity to be made on the elements of these components. Download Pulsonix Trial Summary of features:
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