Leading-edge Technology
For leading-edge PCB designs, the embedded component technology feature provides the essential option for buried components. This technology includes support for buried/printed resistors, buried capacitors, RF spiral inductors, planar transformers, embedded semiconductors and thinned dies.
Buried Semiconductors and Thinned Dies
As part of the European funded Hermes project, Pulsonix has
been enhanced well beyond the current commercial capabilities such is the belief that
Pulsonix can also be used to help steer new technology into the market.
The Hermes project has enabled Pulsonix to introduce the concept of 'thinned' dies and buried semiconductors into inner layer substrates. That's buried into cavities within the layer, as well as the current capability where any component can be added to the surface of an inner layer where build-up technology would then be employed to construct the board 'sandwich'.
Passive Components
Passive resistors can be printed on inner layers and connected by resistive material. Depending on the manufacturing method, a resist mask or encapsulating coating will be required.
The Pulsonix Embedded Components feature handles this by allowing you to associate the necessary additional manufacturing layers for the resistive and other materials with the correct inner copper layer.
Planar Components
The planar converter or transfer component may exist on the outer only or through-hole layers and may have a physical body applied to the outer layers. However, part of the footprint consists of copper spirals which are connected by a component via, effectively joining the two footprint pads.
By defining the footprint as embedded, the Component can be mirrored and all the inner layers will swap as required. Special DRC properties also allow the right internal connectivity to be made on the elements of these components.
3D Viewer
By defining the footprint as embedded, the Component can be mirrored and all the inner layers will swap as required. Special DRC properties also allow the right internal connectivity to be made on the elements of these components.
Summary of features:
- Supports embedded component types for:
- Buried resistors and printed 'internal' resistor components
- Buried capacitors and dielectric/insulator layers
- Planar convertors and transformers
- Embedded semiconductors and thinned dies
- Flexi-rigid embedded components
Download Pulsonix Trial
View the Advanced Technology Datasheet
View the Advanced Technology page
View the Hermes project page
