Embedded Components

Integrated support for designing embedded components

Passive Components

Passive resistors can be printed on inner layers and connected by resistive material. Depending on the manufacturing method, a resist mask or encapsulating coating will be required.

The Pulsonix Embedded Components option handles this by allowing you to associate the necessary additional manufacturing layers for the resistive and other materials with the correct inner copper layer.

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View the Embedded Components Datasheet (English)
View the Embedded Components Datasheet (German)

Planar Components

The planar converter or transfer component may exist on the outer only or through-hole layers and may have a physical body applied to the outer layers. However, part of the footprint consists of copper spirals which are connected by a component via, effectively joining the two footprint pads.

By defining the footprint as embedded, the Component can be mirrored and all the inner layers will swap as required. Special DRC properties also allow the right internal connectivity to be made on the elements of these components.

• Support for embedded resistors and printed 'internal' resistor components
• Support for buried capacitors and dielectric/insulator layers
• Support for planar transformers
• Support for flex/rigid embedded components
• Rules driven technology interface
• Layer definitions and layer class definitions for 'internal' components
• Internal layer definition for supporting layer documentation and associated layers
• Support for mixing conventional, SMD and embedded technologies
• Interactive Spirals and spiral inductor creation
• Manufacturing checks for embedded technologies
• Interactive component layer change feature supports internal layers
• Footprint library creation and support for internal 'SMD' components and pads
• Footprint definition with 'component via' support
• Report Maker output of embedded technology features
• Layers report with reference for embedded components