Advanced Packaging Support
In almost every aspect of normal daily life the need for smaller, lighter
electronics has become a mandatory driving force in their design. With the
Pulsonix Chip Packaging Toolkit, designing with this emerging technology is enabled with a powerful toolset
not normally found in mainstream PCB design systems.
The Toolkit provides options for creation and annotation of die & bond
pads and bond wires, and for automatically placing bond pads around a defined
shape.
Advanced Rule Sets
To support this advanced technology, Pulsonix contains a set of rules that
are obeyed using both the Online DRC and batch design rules checking process
options. Rules can be set for min and max length of the bond pad from the die
pad, and for the crossing over of insulated and non-insulated wires.
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View the Chip Packaging Datasheet
Footprint Creation
The Footprint editor allows fast and simple creation of the advanced
technologies. Options for the insertion of die and bond pads into the footprint
ensure that the correct pad type is used, adding the bond wire at the same time.
Tools for uniform pattern placement are also included.
Where bond pads must be in-line with the wire, this alignment can be maintained
automatically even when the bond pad is rotated or moved in the footprint.
Bond pads in-line with the wire ensures that the wire is
'fired' onto the maximum available 'landing site'.
Component Interaction
Components which contain die and bond pads are handled intelligently using an
advanced rule set. Bond pads can be interactively moved independently of the
main footprint 'body', and this movement is controlled using the additional design rules.
Comprehensive Reports
Pulsonix provides a set of detailed reports that can be used to output wire
positions (X and Y position of each pad landing site and net name). The powerful
Report Maker option also allows all Chip Packaging items to be output, so custom reports can be created.
Key Features
- Insert Bond and Die pads
- Insert Wire between die and bond pads
- Place bond pads around shape
- Finger pad shapes supported with automatic angle offsetting on radial shapes
- Ability to move independently floating bond pads of footprints in design editor
- Library includes a selection of bare die footprints
- Support for insulated or non-insulated (bond) wires
Additional Features (do not require Chip Packaging Toolkit)
- Report Maker can output bond pad and die pad positions
- Report Maker can create a report for manual and automatic wire machines
- On-line and batch design rules checking of:
- Wires crossing (allowed for insulated wires, not allowed for non-insulated
wires)
- Min/max bond wire lengths
- Item colours for bond pads and wires
- Wires inserted on special layer
- Layer Class definitions for bond pad only plots
